Wahlpflichtfächer

Course content:
• Wafer production and doping
• Cleanroom and tools
• Lithography: photo resist, exposure techniques, optics
• Deposition: oxidation, chemical vapor deposition, physical deposition, epitaxy
• Etching: wet chemical etching, dry chemical etching
• Process Integration: CMOS, MEMS
• Numerical simulations: device and process simulations

Learning objectives:
Subject-specific competencies:
• Know various tools used for processing devices
• Know various etching and deposition processes and their different properties / applica-tions
• Understand the influence of process parameters on etching and deposition characteristics
• Basic understanding of optics to improve minimum feature size
• Overview of the process steps for manufacturing complete electrical and mechanical de-vices

Interdisciplinary competencies:
• Application of numerical simulations for development, in this lecture with focus on pro-cess and device simulations

Literature and other sources of information:
• Hans H. Gatzen: Micro and Nano Fabrication, Springer Verlag Berlin 2015
• S. Globisch: Lehrbuch Mikrotechnologie, Carl Hanser Verlag München 2012
• S. Selberherr, Analyses and Simulation of Semiconductor Devices, Springer Verlag Wien NewYork 1984